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Electronic Packaging Materials Market Status and Trend Analysis 2017-2026 (COVID-19 Version) INDUSTRY PRODUCTION


Published on: 2020-12-06 | No of Pages : 85 | Industry : Electronics & Semiconductor

Publisher : 9 | Format : PDF

Electronic Packaging Materials Market Status and Trend Analysis 2017-2026 (COVID-19 Version)

Summary

Further key aspects of the report indicate that:
Chapter 1: Research Scope: Product Definition, Type, End-Use & Methodology
Chapter 2: Global Industry Summary
Chapter 3: Market Dynamics
Chapter 4: Global Market Segmentation by region, type and End-Use
Chapter 5: North America Market Segmentation by region, type and End-Use
Chapter 6: Europe Market Segmentation by region, type and End-Use
Chapter 7: Asia-Pacific Market Segmentation by region, type and End-Use
Chapter 8: South America Market Segmentation by region, type and End-Use
Chapter 9: Middle East and Africa Market Segmentation by region, type and End-Use.
Chapter 10: Market Competition by Companies
Chapter 11: Market forecast and environment forecast.
Chapter 12: Industry Summary.

The global Electronic Packaging Materials market has the potential to grow with xx million USD with growing CAGR in the forecast period from 2021f to 2026f. Factors driving the market for @@@@@ are the significant development of demand and improvement of COVID-19 and geo-economics.

Based on the type of product, the global Electronic Packaging Materials market segmented into
Metal Packages
Plastic Packages
Ceramic Packages

Based on the end-use, the global Electronic Packaging Materials market classified into
Semiconductor & IC
PCB
Others

Based on geography, the global Electronic Packaging Materials market segmented into
North America [U.S., Canada, Mexico]
Europe [Germany, UK, France, Italy, Rest of Europe]
Asia-Pacific [China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific]
South America [Brazil, Argentina, Rest of Latin America]
Middle East & Africa [GCC, North Africa, South Africa, Rest of Middle East and Africa]

And the major players included in the report are
DuPont
Evonik
EPM
Mitsubishi Chemical
Sumitomo Chemical
Mitsui High-tec
Tanaka
Shinko Electric Industries
Panasonic
Hitachi Chemical
Kyocera Chemical
Gore
BASF
Henkel
AMETEK Electronic
Toray
Maruwa
Leatec Fine Ceramics
NCI
Chaozhou Three-Circle
Nippon Micrometal
Toppan
Dai Nippon Printing
Possehl
Ningbo Kangqiang

Table of Content

Table of Contents
1 RESEARCH SCOPE
1.1 Research Product Definition
1.2 Research Segmentation
1.2.1 Product Type
1.2.2 Main product Type of Major Players
1.3 Demand Overview
1.4 Research Methodology
2 GLOBAL ELECTRONIC PACKAGING MATERIALS INDUSTRY
2.1 Summary about Electronic Packaging Materials Industry
2.2 Electronic Packaging Materials Market Trends
2.2.1 Electronic Packaging Materials Production & Consumption Trends
2.2.2 Electronic Packaging Materials Demand Structure Trends
2.3 Electronic Packaging Materials Cost & Price
3 MARKET DYNAMICS
3.1 Manufacturing & Purchasing Behavior in 2020
3.2 Market Development under the Impact of COVID-19
3.2.1 Drivers
3.2.2 Restraints
3.2.3 Opportunity
3.2.4 Risk
4 GLOBAL MARKET SEGMENTATION
4.1 Region Segmentation (2017 to 2021f)
4.1.1 North America (U.S., Canada and Mexico)
4.1.2 Europe (Germany, UK, France, Italy, Rest of Europe)
4.1.3 Asia-Pacific (China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific)
4.1.4 South America (Brazil,, Argentina, Rest of Latin America)
4.1.5 Middle East and Africa (GCC, North Africa, South Africa, Rest of Middle East and Africa)
4.2 Product Type Segmentation (2017 to 2021f)
4.2.1 Metal Packages
4.2.2 Plastic Packages
4.2.3 Ceramic Packages
4.3 Consumption Segmentation (2017 to 2021f)
4.3.1 Semiconductor & IC
4.3.2 PCB
4.3.3 Others
5 NORTH AMERICA MARKET SEGMENT
5.1 Region Segmentation (2017 to 2021f)
5.1.1 U.S.
5.1.2 Canada
5.1.3 Mexico
5.2 Product Type Segmentation (2017 to 2021f)
5.2.1 Metal Packages
5.2.2 Plastic Packages
5.2.3 Ceramic Packages
5.3 Consumption Segmentation (2017 to 2021f)
5.3.1 Semiconductor & IC
5.3.2 PCB
5.3.3 Others
5.4 Impact of COVID-19 in North America
6 EUROPE MARKET SEGMENTATION
6.1 Region Segmentation (2017 to 2021f)
6.1.1 Germany
6.1.2 UK
6.1.3 France
6.1.4 Italy
6.1.5 Rest of Europe
6.2 Product Type Segmentation (2017 to 2021f)
6.2.1 Metal Packages
6.2.2 Plastic Packages
6.2.3 Ceramic Packages
6.3 Consumption Segmentation (2017 to 2021f)
6.3.1 Semiconductor & IC
6.3.2 PCB
6.3.3 Others
6.4 Impact of COVID-19 in Europe
7 ASIA-PACIFIC MARKET SEGMENTATION
7.1 Region Segmentation (2017 to 2021f)
7.1.1 China
7.1.2 India
7.1.3 Japan
7.1.4 South Korea
7.1.5 Southeast Asia
7.1.6 Australia
7.1.7 Rest of Asia Pacific
7.2 Product Type Segmentation (2017 to 2021f)
7.2.1 Metal Packages
7.2.2 Plastic Packages
7.2.3 Ceramic Packages
7.3 Consumption Segmentation (2017 to 2021f)
7.3.1 Semiconductor & IC
7.3.2 PCB
7.3.3 Others
7.4 Impact of COVID-19 in Europe
8 SOUTH AMERICA MARKET SEGMENTATION
8.1 Region Segmentation (2017 to 2021f)
8.1.1 Brazil
8.1.2 Argentina
8.1.3 Rest of Latin America
8.2 Product Type Segmentation (2017 to 2021f)
8.2.1 Metal Packages
8.2.2 Plastic Packages
8.2.3 Ceramic Packages
8.3 Consumption Segmentation (2017 to 2021f)
8.3.1 Semiconductor & IC
8.3.2 PCB
8.3.3 Others
8.4 Impact of COVID-19 in Europe
9 MIDDLE EAST AND AFRICA MARKET SEGMENTATION
9.1 Region Segmentation (2017 to 2021f)
9.1.1 GCC
9.1.2 North Africa
9.1.3 South Africa
9.1.4 Rest of Middle East and Africa
9.2 Product Type Segmentation (2017 to 2021f)
9.2.1 Metal Packages
9.2.2 Plastic Packages
9.2.3 Ceramic Packages
9.3 Consumption Segmentation (2017 to 2021f)
9.3.1 Semiconductor & IC
9.3.2 PCB
9.3.3 Others
9.4 Impact of COVID-19 in Europe
10 COMPETITION OF MAJOR PLAYERS
10.1 Brief Introduction of Major Players
10.1.1 DuPont
10.1.2 Evonik
10.1.3 EPM
10.1.4 Mitsubishi Chemical
10.1.5 Sumitomo Chemical
10.1.6 Mitsui High-tec
10.1.7 Tanaka
10.1.8 Shinko Electric Industries
10.1.9 Panasonic
10.1.10 Hitachi Chemical
10.1.11 Kyocera Chemical
10.1.12 Gore
10.1.13 BASF
10.1.14 Henkel
10.1.15 AMETEK Electronic
10.1.16 Toray
10.1.17 Maruwa
10.1.18 Leatec Fine Ceramics
10.1.19 NCI
10.1.20 Chaozhou Three-Circle
10.1.21 Nippon Micrometal
10.1.22 Toppan
10.1.23 Dai Nippon Printing
10.1.24 Possehl
10.1.25 Ningbo Kangqiang
10.2 Electronic Packaging Materials Sales Date of Major Players (2017-2020e)
10.2.1 DuPont
10.2.2 Evonik
10.2.3 EPM
10.2.4 Mitsubishi Chemical
10.2.5 Sumitomo Chemical
10.2.6 Mitsui High-tec
10.2.7 Tanaka
10.2.8 Shinko Electric Industries
10.2.9 Panasonic
10.2.10 Hitachi Chemical
10.2.11 Kyocera Chemical
10.2.12 Gore
10.2.13 BASF
10.2.14 Henkel
10.2.15 AMETEK Electronic
10.2.16 Toray
10.2.17 Maruwa
10.2.18 Leatec Fine Ceramics
10.2.19 NCI
10.2.20 Chaozhou Three-Circle
10.2.21 Nippon Micrometal
10.2.22 Toppan
10.2.23 Dai Nippon Printing
10.2.24 Possehl
10.2.25 Ningbo Kangqiang
10.3 Market Distribution of Major Players
10.4 Global Competition Segmentation
11 MARKET FORECAST
11.1 Forecast by Region
11.2 Forecast by Demand
11.3 Environment Forecast
11.3.1 Impact of COVID-19
11.3.2 Geopolitics Overview
11.3.3 Economic Overview of Major Countries
12 REPORT SUMMARY STATEMENT

List of Figure

List of Table
Table Electronic Packaging Materials Product Type Overview
Table Electronic Packaging Materials Product Type Market Share List
Table Electronic Packaging Materials Product Type of Major Players
Table Brief Introduction of DuPont
Table Brief Introduction of Evonik
Table Brief Introduction of EPM
Table Brief Introduction of Mitsubishi Chemical
Table Brief Introduction of Sumitomo Chemical
Table Brief Introduction of Mitsui High-tec
Table Brief Introduction of Tanaka
Table Brief Introduction of Shinko Electric Industries
Table Brief Introduction of Panasonic
Table Brief Introduction of Hitachi Chemical
Table Brief Introduction of Kyocera Chemical
Table Brief Introduction of Gore
Table Brief Introduction of BASF
Table Brief Introduction of Henkel
Table Brief Introduction of AMETEK Electronic
Table Brief Introduction of Toray
Table Brief Introduction of Maruwa
Table Brief Introduction of Leatec Fine Ceramics
Table Brief Introduction of NCI
Table Brief Introduction of Chaozhou Three-Circle
Table Brief Introduction of Nippon Micrometal
Table Brief Introduction of Toppan
Table Brief Introduction of Dai Nippon Printing
Table Brief Introduction of Possehl
Table Brief Introduction of Ningbo Kangqiang
Table Products & Services of DuPont
Table Products & Services of Evonik
Table Products & Services of EPM
Table Products & Services of Mitsubishi Chemical
Table Products & Services of Sumitomo Chemical
Table Products & Services of Mitsui High-tec
Table Products & Services of Tanaka
Table Products & Services of Shinko Electric Industries
Table Products & Services of Panasonic
Table Products & Services of Hitachi Chemical
Table Products & Services of Kyocera Chemical
Table Products & Services of Gore
Table Products & Services of BASF
Table Products & Services of Henkel
Table Products & Services of AMETEK Electronic
Table Products & Services of Toray
Table Products & Services of Maruwa
Table Products & Services of Leatec Fine Ceramics
Table Products & Services of NCI
Table Products & Services of Chaozhou Three-Circle
Table Products & Services of Nippon Micrometal
Table Products & Services of Toppan
Table Products & Services of Dai Nippon Printing
Table Products & Services of Possehl
Table Products & Services of Ningbo Kangqiang
Table Market Distribution of Major Players
Table Global Major Players Sales Revenue (Million USD) 2017-2020e
Table Global Major Players Sales Revenue (Million USD) Share 2017-2020e
Table Global Electronic Packaging Materials Market Forecast (Million USD) by Region 2021f-2026f
Table Global Electronic Packaging Materials Market Forecast (Million USD) Share by Region 2021f-2026f
Table Global Electronic Packaging Materials Market Forecast (Million USD) by Demand 2021f-2026f
Table Global Electronic Packaging Materials Market Forecast (Million USD) Share by Demand 2021f-2026f