Global 3D IC and 2.5D IC Packaging Sales Market Report 2024
The global 3D IC and 2.5D IC Packaging market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global 3D IC and 2.5D IC Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.
Segment by Type
3D Wafer-level Chip-scale Packaging
3D TSV
2.5D
Segment by Application
Logic
Imaging & Optoelectronics
Memory
MEMS/Sensors
LED
Power
The 3D IC and 2.5D IC Packaging market is analysed and market size information is provided by regions (countries).
Segment by Application
, the 3D IC and 2.5D IC Packaging market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.

By Company
Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology

Table of Content
1 3D IC and 2.5D IC Packaging Market Overview
1.1 3D IC and 2.5D IC Packaging Product Scope
1.2 3D IC and 2.5D IC Packaging Segment by Type
1.2.1 Global 3D IC and 2.5D IC Packaging Sales by Type (2016 & 2021 & 2027)
1.2.2 3D Wafer-level Chip-scale Packaging
1.2.3 3D TSV
1.2.4 2.5D
1.3 3D IC and 2.5D IC Packaging Segment by Application
1.3.1 Global 3D IC and 2.5D IC Packaging Sales Comparison by Application (2016 & 2021 & 2027)
1.3.2 Logic
1.3.3 Imaging & Optoelectronics
1.3.4 Memory
1.3.5 MEMS/Sensors
1.3.6 LED
1.3.7 Power
1.4 3D IC and 2.5D IC Packaging Market Estimates and Forecasts (2016-2027)
1.4.1 Global 3D IC and 2.5D IC Packaging Market Size in Value Growth Rate (2016-2027)
1.4.2 Global 3D IC and 2.5D IC Packaging Market Size in Volume Growth Rate (2016-2027)
1.4.3 Global 3D IC and 2.5D IC Packaging Price Trends (2016-2027)
2 3D IC and 2.5D IC Packaging Estimates and Forecasts by Region
2.1 Global 3D IC and 2.5D IC Packaging Market Size by Region: 2016 VS 2021 VS 2027
2.2 Global 3D IC and 2.5D IC Packaging Retrospective Market Scenario by Region (2016-2021)
2.2.1 Global 3D IC and 2.5D IC Packaging Sales Market Share by Region (2016-2021)
2.2.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Region (2016-2021)
2.3 Global 3D IC and 2.5D IC Packaging Market Estimates and Forecasts by Region (2022-2027)
2.3.1 Global 3D IC and 2.5D IC Packaging Sales Estimates and Forecasts by Region (2022-2027)
2.3.2 Global 3D IC and 2.5D IC Packaging Revenue Forecast by Region (2022-2027)
2.4 Geographic Market Analysis: Market Facts & Figures
2.4.1 North America 3D IC and 2.5D IC Packaging Estimates and Projections (2016-2027)
2.4.2 Europe 3D IC and 2.5D IC Packaging Estimates and Projections (2016-2027)
2.4.3 China 3D IC and 2.5D IC Packaging Estimates and Projections (2016-2027)
2.4.4 Japan 3D IC and 2.5D IC Packaging Estimates and Projections (2016-2027)
2.4.5 Southeast Asia 3D IC and 2.5D IC Packaging Estimates and Projections (2016-2027)
2.4.6 India 3D IC and 2.5D IC Packaging Estimates and Projections (2016-2027)
3 Global 3D IC and 2.5D IC Packaging Competition Landscape by Players
3.1 Global Top 3D IC and 2.5D IC Packaging Players by Sales (2016-2021)
3.2 Global Top 3D IC and 2.5D IC Packaging Players by Revenue (2016-2021)
3.3 Global 3D IC and 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in 3D IC and 2.5D IC Packaging as of 2020)
3.4 Global 3D IC and 2.5D IC Packaging Average Price by Company (2016-2021)
3.5 Manufacturers 3D IC and 2.5D IC Packaging Manufacturing Sites, Area Served, Product Type
3.6 Manufacturers Mergers & Acquisitions, Expansion Plans
4 Global 3D IC and 2.5D IC Packaging Market Size by Type
4.1 Global 3D IC and 2.5D IC Packaging Historic Market Review by Type (2016-2021)
4.1.1 Global 3D IC and 2.5D IC Packaging Sales Market Share by Type (2016-2021)
4.1.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Type (2016-2021)
4.1.3 Global 3D IC and 2.5D IC Packaging Price by Type (2016-2021)
4.2 Global 3D IC and 2.5D IC Packaging Market Estimates and Forecasts by Type (2022-2027)
4.2.1 Global 3D IC and 2.5D IC Packaging Sales Forecast by Type (2022-2027)
4.2.2 Global 3D IC and 2.5D IC Packaging Revenue Forecast by Type (2022-2027)
4.2.3 Global 3D IC and 2.5D IC Packaging Price Forecast by Type (2022-2027)
5 Global 3D IC and 2.5D IC Packaging Market Size by Application
5.1 Global 3D IC and 2.5D IC Packaging Historic Market Review by Application (2016-2021)
5.1.1 Global 3D IC and 2.5D IC Packaging Sales Market Share by Application (2016-2021)
5.1.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Application (2016-2021)
5.1.3 Global 3D IC and 2.5D IC Packaging Price by Application (2016-2021)
5.2 Global 3D IC and 2.5D IC Packaging Market Estimates and Forecasts by Application (2022-2027)
5.2.1 Global 3D IC and 2.5D IC Packaging Sales Forecast by Application (2022-2027)
5.2.2 Global 3D IC and 2.5D IC Packaging Revenue Forecast by Application (2022-2027)
5.2.3 Global 3D IC and 2.5D IC Packaging Price Forecast by Application (2022-2027)
6 North America 3D IC and 2.5D IC Packaging Market Facts & Figures
6.1 North America 3D IC and 2.5D IC Packaging Sales by Company
6.1.1 North America 3D IC and 2.5D IC Packaging Sales by Company (2016-2021)
6.1.2 North America 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021)
6.2 North America 3D IC and 2.5D IC Packaging Sales Breakdown by Type
6.2.1 North America 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2016-2021)
6.2.2 North America 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2022-2027)
6.3 North America 3D IC and 2.5D IC Packaging Sales Breakdown by Application
6.3.1 North America 3D IC and 2.5D IC Packaging Sales Breakdown by Application (2016-2021)
6.3.2 North America 3D IC and 2.5D IC Packaging Sales Breakdown by Application (2022-2027)
7 Europe 3D IC and 2.5D IC Packaging Market Facts & Figures
7.1 Europe 3D IC and 2.5D IC Packaging Sales by Company
7.1.1 Europe 3D IC and 2.5D IC Packaging Sales by Company (2016-2021)
7.1.2 Europe 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021)
7.2 Europe 3D IC and 2.5D IC Packaging Sales Breakdown by Type
7.2.1 Europe 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2016-2021)
7.2.2 Europe 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2022-2027)
7.3 Europe 3D IC and 2.5D IC Packaging Sales Breakdown by Application
7.3.1 Europe 118 Sales Breakdown by Application (2016-2021)
7.3.2 Europe 118 Sales Breakdown by Application (2022-2027)
8 China 3D IC and 2.5D IC Packaging Market Facts & Figures
8.1 China 3D IC and 2.5D IC Packaging Sales by Company
8.1.1 China 3D IC and 2.5D IC Packaging Sales by Company (2016-2021)
8.1.2 China 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021)
8.2 China 3D IC and 2.5D IC Packaging Sales Breakdown by Type
8.2.1 China 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2016-2021)
8.2.2 China 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2022-2027)
8.3 China 3D IC and 2.5D IC Packaging Sales Breakdown by Application
8.3.1 China 141 Sales Breakdown by Application (2016-2021)
8.3.2 China 141 Sales Breakdown by Application (2022-2027)
9 Japan 3D IC and 2.5D IC Packaging Market Facts & Figures
9.1 Japan 3D IC and 2.5D IC Packaging Sales by Company
9.1.1 Japan 3D IC and 2.5D IC Packaging Sales by Company (2016-2021)
9.1.2 Japan 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021)
9.2 Japan 3D IC and 2.5D IC Packaging Sales Breakdown by Type
9.2.1 Japan 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2016-2021)
9.2.2 Japan 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2022-2027)
9.3 Japan 3D IC and 2.5D IC Packaging Sales Breakdown by Application
9.3.1 Japan Feb. Sales Breakdown by Application (2016-2021)
9.3.2 Japan Feb. Sales Breakdown by Application (2022-2027)
10 Southeast Asia 3D IC and 2.5D IC Packaging Market Facts & Figures
10.1 Southeast Asia 3D IC and 2.5D IC Packaging Sales by Company
10.1.1 Southeast Asia 3D IC and 2.5D IC Packaging Sales by Company (2016-2021)
10.1.2 Southeast Asia 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021)
10.2 Southeast Asia 3D IC and 2.5D IC Packaging Sales Breakdown by Type
10.2.1 Southeast Asia 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2016-2021)
10.2.2 Southeast Asia 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2022-2027)
10.3 Southeast Asia 3D IC and 2.5D IC Packaging Sales Breakdown by Application
10.3.1 Southeast Asia K Units Sales Breakdown by Application (2016-2021)
10.3.2 Southeast Asia K Units Sales Breakdown by Application (2022-2027)
11 India 3D IC and 2.5D IC Packaging Market Facts & Figures
11.1 India 3D IC and 2.5D IC Packaging Sales by Company
11.1.1 India 3D IC and 2.5D IC Packaging Sales by Company (2016-2021)
11.1.2 India 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021)
11.2 India 3D IC and 2.5D IC Packaging Sales Breakdown by Type
11.2.1 India 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2016-2021)
11.2.2 India 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2022-2027)
11.3 India 3D IC and 2.5D IC Packaging Sales Breakdown by Application
11.3.1 India 3D IC and 2.5D IC Packaging Sales Breakdown by Application (2016-2021)
11.3.2 India 3D IC and 2.5D IC Packaging Sales Breakdown by Application (2022-2027)
12 Company Profiles and Key Figures in 3D IC and 2.5D IC Packaging Business
12.1 Taiwan Semiconductor
12.1.1 Taiwan Semiconductor Corporation Information
12.1.2 Taiwan Semiconductor Business Overview
12.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2016-2021)
12.1.4 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Products Offered
12.1.5 Taiwan Semiconductor Recent Development
12.2 Samsung Electronics
12.2.1 Samsung Electronics Corporation Information
12.2.2 Samsung Electronics Business Overview
12.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2016-2021)
12.2.4 Samsung Electronics 3D IC and 2.5D IC Packaging Products Offered
12.2.5 Samsung Electronics Recent Development
12.3 Toshiba Corp
12.3.1 Toshiba Corp Corporation Information
12.3.2 Toshiba Corp Business Overview
12.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2016-2021)
12.3.4 Toshiba Corp 3D IC and 2.5D IC Packaging Products Offered
12.3.5 Toshiba Corp Recent Development
12.4 Advanced Semiconductor Engineering
12.4.1 Advanced Semiconductor Engineering Corporation Information
12.4.2 Advanced Semiconductor Engineering Business Overview
12.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2016-2021)
12.4.4 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Products Offered
12.4.5 Advanced Semiconductor Engineering Recent Development
12.5 Amkor Technology
12.5.1 Amkor Technology Corporation Information
12.5.2 Amkor Technology Business Overview
12.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2016-2021)
12.5.4 Amkor Technology 3D IC and 2.5D IC Packaging Products Offered
12.5.5 Amkor Technology Recent Development
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13 3D IC and 2.5D IC Packaging Manufacturing Cost Analysis
13.1 3D IC and 2.5D IC Packaging Key Raw Materials Analysis
13.1.1 Key Raw Materials
13.1.2 Key Raw Materials Price Trend
13.1.3 Key Suppliers of Raw Materials
13.2 Proportion of Manufacturing Cost Structure
13.3 Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging
13.4 3D IC and 2.5D IC Packaging Industrial Chain Analysis
14 Marketing Channel, Distributors and Customers
14.1 Marketing Channel
14.2 3D IC and 2.5D IC Packaging Distributors List
14.3 3D IC and 2.5D IC Packaging Customers
15 Market Dynamics
15.1 3D IC and 2.5D IC Packaging Market Trends
15.2 3D IC and 2.5D IC Packaging Drivers
15.3 3D IC and 2.5D IC Packaging Market Challenges
15.4 3D IC and 2.5D IC Packaging Market Restraints
16 Research Findings and Conclusion
17 Appendix
17.1 Research Methodology
17.1.1 Methodology/Research Approach
17.1.2 Data Source
17.2 Author List
17.3 Disclaimer