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Global 3D IC and 2.5D IC Packaging Sales Market Report 2024


Published on: 2024-01-04 | No of Pages : 239 | Industry : Electronics & Semiconductor

Publisher : MRA | Format : PDF

Global 3D IC and 2.5D IC Packaging Sales Market Report 2024

The global 3D IC and 2.5D IC Packaging market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global 3D IC and 2.5D IC Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.

Segment by Type
3D Wafer-level Chip-scale Packaging
3D TSV
2.5D


Segment by Application


Logic
Imaging & Optoelectronics
Memory
MEMS/Sensors
LED
Power

The 3D IC and 2.5D IC Packaging market is analysed and market size information is provided by regions (countries).

Segment by Application

, the 3D IC and 2.5D IC Packaging market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.




By Company


Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology

Table of Content

1 3D IC and 2.5D IC Packaging Market Overview
1.1 3D IC and 2.5D IC Packaging Product Scope
1.2 3D IC and 2.5D IC Packaging Segment by Type
1.2.1 Global 3D IC and 2.5D IC Packaging Sales by Type (2016 & 2021 & 2027)
1.2.2 3D Wafer-level Chip-scale Packaging
1.2.3 3D TSV
1.2.4 2.5D
1.3 3D IC and 2.5D IC Packaging Segment by Application
1.3.1 Global 3D IC and 2.5D IC Packaging Sales Comparison by Application (2016 & 2021 & 2027)
1.3.2 Logic
1.3.3 Imaging & Optoelectronics
1.3.4 Memory
1.3.5 MEMS/Sensors
1.3.6 LED
1.3.7 Power
1.4 3D IC and 2.5D IC Packaging Market Estimates and Forecasts (2016-2027)
1.4.1 Global 3D IC and 2.5D IC Packaging Market Size in Value Growth Rate (2016-2027)
1.4.2 Global 3D IC and 2.5D IC Packaging Market Size in Volume Growth Rate (2016-2027)
1.4.3 Global 3D IC and 2.5D IC Packaging Price Trends (2016-2027)

2 3D IC and 2.5D IC Packaging Estimates and Forecasts by Region
2.1 Global 3D IC and 2.5D IC Packaging Market Size by Region: 2016 VS 2021 VS 2027
2.2 Global 3D IC and 2.5D IC Packaging Retrospective Market Scenario by Region (2016-2021)
2.2.1 Global 3D IC and 2.5D IC Packaging Sales Market Share by Region (2016-2021)
2.2.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Region (2016-2021)
2.3 Global 3D IC and 2.5D IC Packaging Market Estimates and Forecasts by Region (2022-2027)
2.3.1 Global 3D IC and 2.5D IC Packaging Sales Estimates and Forecasts by Region (2022-2027)
2.3.2 Global 3D IC and 2.5D IC Packaging Revenue Forecast by Region (2022-2027)
2.4 Geographic Market Analysis: Market Facts & Figures
2.4.1 North America 3D IC and 2.5D IC Packaging Estimates and Projections (2016-2027)
2.4.2 Europe 3D IC and 2.5D IC Packaging Estimates and Projections (2016-2027)
2.4.3 China 3D IC and 2.5D IC Packaging Estimates and Projections (2016-2027)
2.4.4 Japan 3D IC and 2.5D IC Packaging Estimates and Projections (2016-2027)
2.4.5 Southeast Asia 3D IC and 2.5D IC Packaging Estimates and Projections (2016-2027)
2.4.6 India 3D IC and 2.5D IC Packaging Estimates and Projections (2016-2027)

3 Global 3D IC and 2.5D IC Packaging Competition Landscape by Players
3.1 Global Top 3D IC and 2.5D IC Packaging Players by Sales (2016-2021)
3.2 Global Top 3D IC and 2.5D IC Packaging Players by Revenue (2016-2021)
3.3 Global 3D IC and 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in 3D IC and 2.5D IC Packaging as of 2020)
3.4 Global 3D IC and 2.5D IC Packaging Average Price by Company (2016-2021)
3.5 Manufacturers 3D IC and 2.5D IC Packaging Manufacturing Sites, Area Served, Product Type
3.6 Manufacturers Mergers & Acquisitions, Expansion Plans

4 Global 3D IC and 2.5D IC Packaging Market Size by Type
4.1 Global 3D IC and 2.5D IC Packaging Historic Market Review by Type (2016-2021)
4.1.1 Global 3D IC and 2.5D IC Packaging Sales Market Share by Type (2016-2021)
4.1.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Type (2016-2021)
4.1.3 Global 3D IC and 2.5D IC Packaging Price by Type (2016-2021)
4.2 Global 3D IC and 2.5D IC Packaging Market Estimates and Forecasts by Type (2022-2027)
4.2.1 Global 3D IC and 2.5D IC Packaging Sales Forecast by Type (2022-2027)
4.2.2 Global 3D IC and 2.5D IC Packaging Revenue Forecast by Type (2022-2027)
4.2.3 Global 3D IC and 2.5D IC Packaging Price Forecast by Type (2022-2027)

5 Global 3D IC and 2.5D IC Packaging Market Size by Application
5.1 Global 3D IC and 2.5D IC Packaging Historic Market Review by Application (2016-2021)
5.1.1 Global 3D IC and 2.5D IC Packaging Sales Market Share by Application (2016-2021)
5.1.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Application (2016-2021)
5.1.3 Global 3D IC and 2.5D IC Packaging Price by Application (2016-2021)
5.2 Global 3D IC and 2.5D IC Packaging Market Estimates and Forecasts by Application (2022-2027)
5.2.1 Global 3D IC and 2.5D IC Packaging Sales Forecast by Application (2022-2027)
5.2.2 Global 3D IC and 2.5D IC Packaging Revenue Forecast by Application (2022-2027)
5.2.3 Global 3D IC and 2.5D IC Packaging Price Forecast by Application (2022-2027)

6 North America 3D IC and 2.5D IC Packaging Market Facts & Figures
6.1 North America 3D IC and 2.5D IC Packaging Sales by Company
6.1.1 North America 3D IC and 2.5D IC Packaging Sales by Company (2016-2021)
6.1.2 North America 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021)
6.2 North America 3D IC and 2.5D IC Packaging Sales Breakdown by Type
6.2.1 North America 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2016-2021)
6.2.2 North America 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2022-2027)
6.3 North America 3D IC and 2.5D IC Packaging Sales Breakdown by Application
6.3.1 North America 3D IC and 2.5D IC Packaging Sales Breakdown by Application (2016-2021)
6.3.2 North America 3D IC and 2.5D IC Packaging Sales Breakdown by Application (2022-2027)

7 Europe 3D IC and 2.5D IC Packaging Market Facts & Figures
7.1 Europe 3D IC and 2.5D IC Packaging Sales by Company
7.1.1 Europe 3D IC and 2.5D IC Packaging Sales by Company (2016-2021)
7.1.2 Europe 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021)
7.2 Europe 3D IC and 2.5D IC Packaging Sales Breakdown by Type
7.2.1 Europe 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2016-2021)
7.2.2 Europe 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2022-2027)
7.3 Europe 3D IC and 2.5D IC Packaging Sales Breakdown by Application
7.3.1 Europe 118 Sales Breakdown by Application (2016-2021)
7.3.2 Europe 118 Sales Breakdown by Application (2022-2027)

8 China 3D IC and 2.5D IC Packaging Market Facts & Figures
8.1 China 3D IC and 2.5D IC Packaging Sales by Company
8.1.1 China 3D IC and 2.5D IC Packaging Sales by Company (2016-2021)
8.1.2 China 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021)
8.2 China 3D IC and 2.5D IC Packaging Sales Breakdown by Type
8.2.1 China 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2016-2021)
8.2.2 China 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2022-2027)
8.3 China 3D IC and 2.5D IC Packaging Sales Breakdown by Application
8.3.1 China 141 Sales Breakdown by Application (2016-2021)
8.3.2 China 141 Sales Breakdown by Application (2022-2027)

9 Japan 3D IC and 2.5D IC Packaging Market Facts & Figures
9.1 Japan 3D IC and 2.5D IC Packaging Sales by Company
9.1.1 Japan 3D IC and 2.5D IC Packaging Sales by Company (2016-2021)
9.1.2 Japan 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021)
9.2 Japan 3D IC and 2.5D IC Packaging Sales Breakdown by Type
9.2.1 Japan 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2016-2021)
9.2.2 Japan 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2022-2027)
9.3 Japan 3D IC and 2.5D IC Packaging Sales Breakdown by Application
9.3.1 Japan Feb. Sales Breakdown by Application (2016-2021)
9.3.2 Japan Feb. Sales Breakdown by Application (2022-2027)

10 Southeast Asia 3D IC and 2.5D IC Packaging Market Facts & Figures
10.1 Southeast Asia 3D IC and 2.5D IC Packaging Sales by Company
10.1.1 Southeast Asia 3D IC and 2.5D IC Packaging Sales by Company (2016-2021)
10.1.2 Southeast Asia 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021)
10.2 Southeast Asia 3D IC and 2.5D IC Packaging Sales Breakdown by Type
10.2.1 Southeast Asia 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2016-2021)
10.2.2 Southeast Asia 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2022-2027)
10.3 Southeast Asia 3D IC and 2.5D IC Packaging Sales Breakdown by Application
10.3.1 Southeast Asia K Units Sales Breakdown by Application (2016-2021)
10.3.2 Southeast Asia K Units Sales Breakdown by Application (2022-2027)

11 India 3D IC and 2.5D IC Packaging Market Facts & Figures
11.1 India 3D IC and 2.5D IC Packaging Sales by Company
11.1.1 India 3D IC and 2.5D IC Packaging Sales by Company (2016-2021)
11.1.2 India 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021)
11.2 India 3D IC and 2.5D IC Packaging Sales Breakdown by Type
11.2.1 India 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2016-2021)
11.2.2 India 3D IC and 2.5D IC Packaging Sales Breakdown by Type (2022-2027)
11.3 India 3D IC and 2.5D IC Packaging Sales Breakdown by Application
11.3.1 India 3D IC and 2.5D IC Packaging Sales Breakdown by Application (2016-2021)
11.3.2 India 3D IC and 2.5D IC Packaging Sales Breakdown by Application (2022-2027)

12 Company Profiles and Key Figures in 3D IC and 2.5D IC Packaging Business
12.1 Taiwan Semiconductor
12.1.1 Taiwan Semiconductor Corporation Information
12.1.2 Taiwan Semiconductor Business Overview
12.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2016-2021)
12.1.4 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Products Offered
12.1.5 Taiwan Semiconductor Recent Development
12.2 Samsung Electronics
12.2.1 Samsung Electronics Corporation Information
12.2.2 Samsung Electronics Business Overview
12.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2016-2021)
12.2.4 Samsung Electronics 3D IC and 2.5D IC Packaging Products Offered
12.2.5 Samsung Electronics Recent Development
12.3 Toshiba Corp
12.3.1 Toshiba Corp Corporation Information
12.3.2 Toshiba Corp Business Overview
12.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2016-2021)
12.3.4 Toshiba Corp 3D IC and 2.5D IC Packaging Products Offered
12.3.5 Toshiba Corp Recent Development
12.4 Advanced Semiconductor Engineering
12.4.1 Advanced Semiconductor Engineering Corporation Information
12.4.2 Advanced Semiconductor Engineering Business Overview
12.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2016-2021)
12.4.4 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Products Offered
12.4.5 Advanced Semiconductor Engineering Recent Development
12.5 Amkor Technology
12.5.1 Amkor Technology Corporation Information
12.5.2 Amkor Technology Business Overview
12.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2016-2021)
12.5.4 Amkor Technology 3D IC and 2.5D IC Packaging Products Offered
12.5.5 Amkor Technology Recent Development
...

13 3D IC and 2.5D IC Packaging Manufacturing Cost Analysis
13.1 3D IC and 2.5D IC Packaging Key Raw Materials Analysis
13.1.1 Key Raw Materials
13.1.2 Key Raw Materials Price Trend
13.1.3 Key Suppliers of Raw Materials
13.2 Proportion of Manufacturing Cost Structure
13.3 Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging
13.4 3D IC and 2.5D IC Packaging Industrial Chain Analysis

14 Marketing Channel, Distributors and Customers
14.1 Marketing Channel
14.2 3D IC and 2.5D IC Packaging Distributors List
14.3 3D IC and 2.5D IC Packaging Customers

15 Market Dynamics
15.1 3D IC and 2.5D IC Packaging Market Trends
15.2 3D IC and 2.5D IC Packaging Drivers
15.3 3D IC and 2.5D IC Packaging Market Challenges
15.4 3D IC and 2.5D IC Packaging Market Restraints

16 Research Findings and Conclusion

17 Appendix
17.1 Research Methodology
17.1.1 Methodology/Research Approach
17.1.2 Data Source
17.2 Author List
17.3 Disclaimer

List of Figure

List of Tables
Table 1. Global 3D IC and 2.5D IC Packaging Sales (US$ Million) Growth Rate by Type (2016 & 2021 & 2027)
Table 2. Global 3D IC and 2.5D IC Packaging Sales ((US$ Million)) Comparison by Application (2016 & 2021 & 2027)
Table 3. Global 3D IC and 2.5D IC Packaging Market Size (US$ Million) by Region: 2016 VS 2021 &2027
Table 4. Global 3D IC and 2.5D IC Packaging Sales (K Units) by Region (2016-2021)
Table 5. Global 3D IC and 2.5D IC Packaging Sales Market Share by Region (2016-2021)
Table 6. Global 3D IC and 2.5D IC Packaging Revenue (US$ Million) Market Share by Region (2016-2021))
Table 7. Global 3D IC and 2.5D IC Packaging Revenue Share by Region (2016-2021)
Table 8. Global 3D IC and 2.5D IC Packaging Sales (K Units) Forecast by Region (2022-2027)
Table 9. Global 3D IC and 2.5D IC Packaging Sales Market Share Forecast by Region (2022-2027)
Table 10. Global 3D IC and 2.5D IC Packaging Revenue (US$ Million) Forecast by Region (2022-2027)
Table 11. Global 3D IC and 2.5D IC Packaging Revenue Share Forecast by Region (2022-2027)
Table 12. Global 3D IC and 2.5D IC Packaging Sales (K Units) of Key Companies (2016-2021)
Table 13. Global 3D IC and 2.5D IC Packaging Sales Share by Company (2016-2021)
Table 14. Global 3D IC and 2.5D IC Packaging Revenue (US$ Million) by Company (2016-2021)
Table 15. Global 3D IC and 2.5D IC Packaging Revenue Share by Company (2016-2021)
Table 16. Global 3D IC and 2.5D IC Packaging by Company Type (Tier 1, Tier 2 and Tier 3) (based on the Revenue in 3D IC and 2.5D IC Packaging as of 2020)
Table 17. Global 3D IC and 2.5D IC Packaging Average Price (K USD/Unit) of Key Company (2016-2021)
Table 18. Manufacturers 3D IC and 2.5D IC Packaging Manufacturing Sites and Area Served
Table 19. Manufacturers 3D IC and 2.5D IC Packaging Product Type
Table 20. Manufacturers Mergers & Acquisitions, Expansion Plans
Table 21. Global 3D IC and 2.5D IC Packaging Sales (K Units) by Type (2016-2021)
Table 22. Global 3D IC and 2.5D IC Packaging Sales Share by Type (2016-2021)
Table 23. Global 3D IC and 2.5D IC Packaging Revenue (US$ Million) Market Share by Type (2016-2021)
Table 24. Global 3D IC and 2.5D IC Packaging Price (K USD/Unit) by Type (2016-2021)
Table 25. Global 3D IC and 2.5D IC Packaging Sales Share by Type (2022-2027)
Table 26. Global 3D IC and 2.5D IC Packaging Revenue (US$ Million) Market Share by Type (2022-2027)
Table 27. Global 3D IC and 2.5D IC Packaging Revenue Share by Type (2022-2027)
Table 28. Global 3D IC and 2.5D IC Packaging Price (K USD/Unit) by Type (2022-2027)
Table 29. Global 3D IC and 2.5D IC Packaging Sales (K Units) by Application (2016-2021)
Table 30. Global 3D IC and 2.5D IC Packaging Sales Share by Application (2016-2021)
Table 31. Global 3D IC and 2.5D IC Packaging Revenue (US$ Million) Market Share by Application (2016-2021)
Table 32. Global 3D IC and 2.5D IC Packaging Price (K USD/Unit) by Application (2016-2021)
Table 33. Global 3D IC and 2.5D IC Packaging Sales (K Units) by Application (2022-2027)
Table 34. Global 3D IC and 2.5D IC Packaging Sales Share by Application (2022-2027)
Table 35. Global 3D IC and 2.5D IC Packaging Revenue (US$ Million) Market Share by Application (2022-2027)
Table 36. Global 3D IC and 2.5D IC Packaging Revenue Share by Application (2022-2027)
Table 37. Global 3D IC and 2.5D IC Packaging Price (K USD/Unit) by Application (2022-2027)
Table 38. North America 3D IC and 2.5D IC Packaging Sales (K Units) by Company (2016-2021)
Table 39. North America 3D IC and 2.5D IC Packaging Sales Market Share by Company (2016-2021)
Table 40. North America 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021) & (US$ Million)
Table 41. North America 3D IC and 2.5D IC Packaging Revenue Market Share by Company (2016-2021)
Table 42. North America 3D IC and 2.5D IC Packaging Sales by Type (2016-2021) & (K Units)
Table 43. North America 3D IC and 2.5D IC Packaging Sales Market Share by Type (2016-2021)
Table 44. North America 3D IC and 2.5D IC Packaging Sales by Type (2022-2027) & (K Units)
Table 45. North America 3D IC and 2.5D IC Packaging Sales Market Share by Type (2022-2027)
Table 46. North America 3D IC and 2.5D IC Packaging Sales by Application (2016-2021) & (K Units)
Table 47. North America 3D IC and 2.5D IC Packaging Sales Market Share by Application (2016-2021)
Table 48. North America 3D IC and 2.5D IC Packaging Sales by Application (2022-2027) & (K Units)
Table 49. North America 3D IC and 2.5D IC Packaging Sales Market Share by Application (2022-2027)
Table 50. Europe 3D IC and 2.5D IC Packaging Sales (K Units) by Company (2016-2021)
Table 51. Europe 3D IC and 2.5D IC Packaging Sales Market Share by Company (2016-2021)
Table 52. Europe 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021) & (US$ Million)
Table 53. Europe 3D IC and 2.5D IC Packaging Revenue Market Share by Company (2016-2021)
Table 54. Europe 3D IC and 2.5D IC Packaging Sales by Type (2016-2021) & (K Units)
Table 55. Europe 3D IC and 2.5D IC Packaging Sales Market Share by Type (2016-2021)
Table 56. Europe 3D IC and 2.5D IC Packaging Sales by Type (2022-2027) & (K Units)
Table 57. Europe 3D IC and 2.5D IC Packaging Sales Market Share by Type (2022-2027)
Table 58. Europe 3D IC and 2.5D IC Packaging Sales by Application (2016-2021) & (K Units)
Table 59. Europe 3D IC and 2.5D IC Packaging Sales Market Share by Application (2016-2021)
Table 60. Europe 3D IC and 2.5D IC Packaging Sales by Application (2022-2027) & (K Units)
Table 61. Europe 3D IC and 2.5D IC Packaging Sales Market Share by Application (2022-2027)
Table 62. China 3D IC and 2.5D IC Packaging Sales (K Units) by Company (2016-2021)
Table 63. China 3D IC and 2.5D IC Packaging Sales Market Share by Company (2016-2021)
Table 64. China 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021) & (US$ Million)
Table 65. China 3D IC and 2.5D IC Packaging Revenue Market Share by Company (2016-2021)
Table 66. China 3D IC and 2.5D IC Packaging Sales by Type (2016-2021) & (K Units)
Table 67. China 3D IC and 2.5D IC Packaging Sales Market Share by Type (2016-2021)
Table 68. China 3D IC and 2.5D IC Packaging Sales by Type (2022-2027) & (K Units)
Table 69. China 3D IC and 2.5D IC Packaging Sales Market Share by Type (2022-2027)
Table 70. China 3D IC and 2.5D IC Packaging Sales by Application (2016-2021) & (K Units)
Table 71. China 3D IC and 2.5D IC Packaging Sales Market Share by Application (2016-2021)
Table 72. China 3D IC and 2.5D IC Packaging Sales by Application (2022-2027) & (K Units)
Table 73. China 3D IC and 2.5D IC Packaging Sales Market Share by Application (2022-2027)
Table 74. Japan 3D IC and 2.5D IC Packaging Sales (K Units) by Company (2016-2021)
Table 75. Japan 3D IC and 2.5D IC Packaging Sales Market Share by Company (2016-2021)
Table 76. Japan 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021) & (US$ Million)
Table 77. Japan 3D IC and 2.5D IC Packaging Revenue Market Share by Company (2016-2021)
Table 78. Japan 3D IC and 2.5D IC Packaging Sales by Type (2016-2021) & (K Units)
Table 79. Japan 3D IC and 2.5D IC Packaging Sales Market Share by Type (2016-2021)
Table 80. Japan 3D IC and 2.5D IC Packaging Sales by Type (2022-2027) & (K Units)
Table 81. Japan 3D IC and 2.5D IC Packaging Sales Market Share by Type (2022-2027)
Table 82. Japan 3D IC and 2.5D IC Packaging Sales by Application (2016-2021) & (K Units)
Table 83. Japan 3D IC and 2.5D IC Packaging Sales Market Share by Application (2016-2021)
Table 84. Japan 3D IC and 2.5D IC Packaging Sales by Application (2022-2027) & (K Units)
Table 85. Japan 3D IC and 2.5D IC Packaging Sales Market Share by Application (2022-2027)
Table 86. Southeast Asia 3D IC and 2.5D IC Packaging Sales (K Units) by Company (2016-2021)
Table 87. Southeast Asia 3D IC and 2.5D IC Packaging Sales Market Share by Company (2016-2021)
Table 88. Southeast Asia 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021) & (US$ Million)
Table 89. Southeast Asia 3D IC and 2.5D IC Packaging Revenue Market Share by Company (2016-2021)
Table 90. Southeast Asia 3D IC and 2.5D IC Packaging Sales by Type (2016-2021) & (K Units)
Table 91. Southeast Asia 3D IC and 2.5D IC Packaging Sales Market Share by Type (2016-2021)
Table 92. Southeast Asia 3D IC and 2.5D IC Packaging Sales by Type (2022-2027) & (K Units)
Table 93. Southeast Asia 3D IC and 2.5D IC Packaging Sales Market Share by Type (2022-2027)
Table 94. Southeast Asia 3D IC and 2.5D IC Packaging Sales by Application (2016-2021) & (K Units)
Table 95. Southeast Asia 3D IC and 2.5D IC Packaging Sales Market Share by Application (2016-2021)
Table 96. Southeast Asia 3D IC and 2.5D IC Packaging Sales by Application (2022-2027) & (K Units)
Table 97. Southeast Asia 3D IC and 2.5D IC Packaging Sales Market Share by Application (2022-2027)
Table 98. India 3D IC and 2.5D IC Packaging Sales (K Units) by Company (2016-2021)
Table 99. India 3D IC and 2.5D IC Packaging Sales Market Share by Company (2016-2021)
Table 100. India 3D IC and 2.5D IC Packaging Revenue by Company (2016-2021) & (US$ Million)
Table 101. India 3D IC and 2.5D IC Packaging Revenue Market Share by Company (2016-2021)
Table 102. India 3D IC and 2.5D IC Packaging Sales by Type (2016-2021) & (K Units)
Table 103. India 3D IC and 2.5D IC Packaging Sales Market Share by Type (2016-2021)
Table 104. India 3D IC and 2.5D IC Packaging Sales by Type (2022-2027) & (K Units)
Table 105. India 3D IC and 2.5D IC Packaging Sales Market Share by Type (2022-2027)
Table 106. India 3D IC and 2.5D IC Packaging Sales by Application (2016-2021) & (K Units)
Table 107. India 3D IC and 2.5D IC Packaging Sales Market Share by Application (2016-2021)
Table 108. India 3D IC and 2.5D IC Packaging Sales by Application (2022-2027) & (K Units)
Table 109. India 3D IC and 2.5D IC Packaging Sales Market Share by Application (2022-2027)
Table 110. Taiwan Semiconductor Corporation Information
Table 111. Taiwan Semiconductor Description and Business Overview
Table 112. Taiwan Semiconductor 3D IC and 2.5D IC Packaging Sales (K Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 113. Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product
Table 114. Taiwan Semiconductor Recent Development
Table 115. Samsung Electronics Corporation Information
Table 116. Samsung Electronics Description and Business Overview
Table 117. Samsung Electronics 3D IC and 2.5D IC Packaging Sales (K Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 118. Samsung Electronics 3D IC and 2.5D IC Packaging Product
Table 119. Samsung Electronics Recent Development
Table 120. Toshiba Corp Corporation Information
Table 121. Toshiba Corp Description and Business Overview
Table 122. Toshiba Corp 3D IC and 2.5D IC Packaging Sales (K Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 123. Toshiba Corp 3D IC and 2.5D IC Packaging Product
Table 124. Toshiba Corp Recent Development
Table 125. Advanced Semiconductor Engineering Corporation Information
Table 126. Advanced Semiconductor Engineering Description and Business Overview
Table 127. Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Sales (K Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 128. Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product
Table 129. Advanced Semiconductor Engineering Recent Development
Table 130. Amkor Technology Corporation Information
Table 131. Amkor Technology Description and Business Overview
Table 132. Amkor Technology 3D IC and 2.5D IC Packaging Sales (K Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 133. Amkor Technology 3D IC and 2.5D IC Packaging Product
Table 134. Amkor Technology Recent Development
Table 135. Production Base and Market Concentration Rate of Raw Material
Table 136. Key Suppliers of Raw Materials
Table 137. 3D IC and 2.5D IC Packaging Distributors List
Table 138. 3D IC and 2.5D IC Packaging Customers List
Table 139. 3D IC and 2.5D IC Packaging Market Trends
Table 140. 3D IC and 2.5D IC Packaging Market Drivers
Table 141. 3D IC and 2.5D IC Packaging Market Challenges
Table 142. 3D IC and 2.5D IC Packaging Market Restraints
Table 143. Research Programs/Design for This Report
Table 144. Key Data Information from Secondary Sources
Table 145. Key Data Information from Primary Sources
List of Figures
Figure 1. 3D IC and 2.5D IC Packaging Product Picture
Figure 2. Global 3D IC and 2.5D IC Packaging Sales Market Share by Type in 2021 & 2027
Figure 3. 3D Wafer-level Chip-scale Packaging Product Picture
Figure 4. 3D TSV Product Picture
Figure 5. 2.5D Product Picture
Figure 6. Global 3D IC and 2.5D IC Packaging Sales Market Share by Application in 2021 & 2027
Figure 7. Logic Examples
Figure 8. Imaging & Optoelectronics Examples
Figure 9. Memory Examples
Figure 10. MEMS/Sensors Examples
Figure 11. LED Examples
Figure 12. Power Examples
Figure 13. Global 3D IC and 2.5D IC Packaging Sales, (US$ Million), 2016 VS 2021 VS 2027
Figure 14. Global 3D IC and 2.5D IC Packaging Sales Growth Rate (2016-2027) & (US$ Million)
Figure 15. Global 3D IC and 2.5D IC Packaging Sales (K Units) Growth Rate (2016-2027)
Figure 16. Global 3D IC and 2.5D IC Packaging Price Trends Growth Rate (2016-2027) (K USD/Unit)
Figure 17. Global 3D IC and 2.5D IC Packaging Revenue Market Share by Region: 2016 VS 2021
Figure 18. Global 3D IC and 2.5D IC Packaging Revenue Market Share by Region: 2021 VS 2027
Figure 19. North America 3D IC and 2.5D IC Packaging Revenue (Million USD) Growth Rate (2016-2027)
Figure 20. North America 3D IC and 2.5D IC Packaging Sales (K Units) Growth Rate (2016-2027)
Figure 21. Europe 3D IC and 2.5D IC Packaging Revenue (Million USD) Growth Rate (2016-2027)
Figure 22. Europe 3D IC and 2.5D IC Packaging Sales (Million USD) Growth Rate (2016-2027)
Figure 23. China 3D IC and 2.5D IC Packaging Revenue (Million USD) Growth Rate (2016-2027)
Figure 24. China 3D IC and 2.5D IC Packaging Sales (Million USD) and Growth Rate (2016-2027)
Figure 25. Japan 3D IC and 2.5D IC Packaging Revenue (Million USD) Growth Rate (2016-2027)
Figure 26. Japan 3D IC and 2.5D IC Packaging Sales (Million USD) Growth Rate (2016-2027)
Figure 27. Southeast Asia 3D IC and 2.5D IC Packaging Revenue (Million USD) Growth Rate (2016-2027)
Figure 28. Southeast Asia 3D IC and 2.5D IC Packaging Sales (Million USD) Growth Rate (2016-2027)
Figure 29. India 3D IC and 2.5D IC Packaging Revenue (Million USD) Growth Rate (2016-2027)
Figure 30. India 3D IC and 2.5D IC Packaging Sales (Million USD) Growth Rate (2016-2027)
Figure 31. Global 5 Largest 3D IC and 2.5D IC Packaging Players Market Share by Revenue in 3D IC and 2.5D IC Packaging: 2016 & 2020
Figure 32. 3D IC and 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3): 2016 VS 2020
Figure 33. Global 3D IC and 2.5D IC Packaging Revenue Share by Type (2016-2021)
Figure 34. Global 3D IC and 2.5D IC Packaging Revenue Growth Rate by Type in 2016 & 2020
Figure 35. Global 3D IC and 2.5D IC Packaging Revenue Share by Application (2016-2021)
Figure 36. Global 3D IC and 2.5D IC Packaging Revenue Growth Rate by Application in 2016 & 2020
Figure 37. North America 3D IC and 2.5D IC Packaging Sales Market Share by Type in 2020
Figure 38. North America 3D IC and 2.5D IC Packaging Sales Market Share by Application in 2020
Figure 39. Europe 3D IC and 2.5D IC Packaging Sales Market Share by Type in 2020
Figure 40. Europe 3D IC and 2.5D IC Packaging Sales Market Share by Application in 2020
Figure 41. China 3D IC and 2.5D IC Packaging Sales Market Share by Type in 2020
Figure 42. China 3D IC and 2.5D IC Packaging Sales Market Share by Application in 2020
Figure 43. Japan 3D IC and 2.5D IC Packaging Sales Market Share by Type in 2020
Figure 44. Japan 3D IC and 2.5D IC Packaging Sales Market Share by Application in 2020
Figure 45. Southeast Asia 3D IC and 2.5D IC Packaging Sales Market Share by Type in 2020
Figure 46. Southeast Asia 3D IC and 2.5D IC Packaging Sales Market Share by Application in 2020
Figure 47. India 3D IC and 2.5D IC Packaging Sales Market Share by Type in 2020
Figure 48. India 3D IC and 2.5D IC Packaging Sales Market Share by Application in 2020
Figure 49. Key Raw Materials Price Trend
Figure 50. Manufacturing Cost Structure of 3D IC and 2.5D IC Packaging
Figure 51. Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging
Figure 52. 3D IC and 2.5D IC Packaging Industrial Chain Analysis
Figure 53. Channels of Distribution
Figure 54. Distributors Profiles
Figure 55. Bottom-up and Top-down Approaches for This Report
Figure 56. Data Triangulation
Figure 57. Key Executives Interviewed